Introduction | R&D Introduction | Qualification |
 
 

Product Introduction

 
 
Capability
 

Ø          Layer Count

2~28 Layer Rigid Board

Ø          Material

High Tg, Low Dk,FR-4,RCC,Rogers,Green laminate

Ø          Minimum Line Width/Space

0.05mm/0.05mm

Ø          Aspect Ratio

9

Ø          Min Drill Size

0.2mm

Ø          Min Laser Drill Size

0.1mm

Ø          Overall Board Thickness

0.25mm ~ 4.57mm

Ø          Surface Finish

HASLNi/AuOSPImmersion Silver

Ø          Via Hole Technology

PTHBaried/Blind viaStack ViaVia Filled

Ø          Impedance

± 7.5%

 
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